Microelectronics II
Code
11045
Academic unit
Faculdade de Ciências e Tecnologia
Department
Departamento de Ciências dos Materiais
Credits
6.0
Teacher in charge
Luís Miguel Nunes Pereira
Weekly hours
6
Total hours
90
Teaching language
Português
Objectives
The UC of Microeletrónica II aims to give continuity to Microeletrónica I, transmitting to the student an advanced formation in materials and devices for microelectronics (conventional and new ones), complementary processing techniques and miniaturization (and its challenges).
Prerequisites
In the UC of Microeletrónica II there is no mandatory precedence. However, it is recommended that students have some well-structured knowledge from previous semesters UCs such as Materiais Semicondutores, Electrónica (I and II) e Microeletrónica I.
Subject matter
1. Miniaturization
Moores’ Law and challenges; Tolerances and rules of circuit layout
2. Materials
The crystalline and polycrystalline silicon; Dielectrics; Materials of low permittivity; Metals and alloys
3.Additional ICs processing techniques
Epitaxy, CVD and its variants, namely, PECVD, LPCVD, APCVD, MOCVD and ALD
4. Lithography and erosion
High-definition photolithography; Electron beam lithography; X-ray lithography; Ion projection lithography; Laser scribing; Alternative patterning techniques: inkjet, embossing (nanoimprinting); Wet etching; Dry etching
5. MEMS
6. New materials
Semiconductor oxides; Nanomaterials and nanostructures
7. The future of Microelectronics
Starting on 2016/17
Introduction
-
Presentation and review of diode junctions
Devices
-
Bipolar
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JFETs
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MOSFETs
-
CMOS
-
TFTs
-
EGFETs
Miniaturization
-
Moore''s Law and challenges;
-
Materials
-
Strain silicon
-
Silicon on insulator ◦
-
high k dieletrics
-
low k materiais for interconnects
-
metais and alloys
MEMS
-
type of structures
-
applications
-
production Process
-
NEMS
Future of microelectronics
-
Transistors with 1 and 2D materials, Resonance tunnel diodes / single electron transistors
Bibliography
- Semiconductor Integrated Circuit Processing Technology, W. R. Runyan, K. E. Bean, Addison-Wesley; Revised edition, 1990
- ULSI technology, C. Y. Chang, S. M. Sze, McGraw-Hill, 1996
- Microelectronic processing: an introduction to the manufacture of integrated circuits, Walter Scot Ruska, McGraw-Hill, 1987
- Microelectronic Circuits, Adele Sedra, Keneth Smith, Oxford University Press, 4th edition, 1997
- The Science and Engineering of Microelectronic Fabrication, Stephen A. Campbell, Oxford University Press, 2 edition, 2001
- Microelectronics Circuit Analysis and Design, Donald Neamen, McGraw-Hill, 4th edition, 2009
- Transparent electronics: from synthesis to devices, edited by Antonio Facchetti e Tobin Marks, Wiley 2010
- Transparent oxide electronics: from materials to devices, P. Barquinha, R. Martins, L. Pereira, E. Fortunato, Wiley 2012)
Teaching method
The teaching of the UC’s subjects is divided in theoretical, theoretical-practical and laboratory, classroom lessons. In addition, there is tutorial teaching, monitoring of students, subject to review by the oral discussion.
Evaluation method
Final score
50% average test or exam
50% report score
Approval with frequency and weighted average> 9.5 V / Average of tests or exam> 9.5 V
Tests / Exam
2 tests (optional), minimum 8V
1 exam season
Reports
Group - lab classes (manufacture MEMS)
Delivery 15 days after the last class
Frequency
Presence at laboratory classes and score of the report> 9.5 V